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1/23 tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 ? 14? 001 1200v high voltage high & low-side, gate driver BM60210FV-C general description the BM60210FV-C is a monolithic high and low side gate drive ic, which can be drive high speed power mosfet and igbt driver with bootstrap operation. the floating channel can be used to driven an n-channel power mosfet or igbt in the high side configuration which operates up to 1200v. it incorporates the faul t signal output functions, under-voltage lockout (uvlo) function and miller clamp function. features ? floating channels for bootstrap operation to +1200v. ? gate drive supply range from 10v to24v ? built-in under voltage lockout for both channels ? 3.3v and 5.0v input logic compatible ? active miller clamping ? aec-q100 qualified (note 1) (note 1:grade1) applications ? mosfet gate driver ? igbt gate driver key specifications ? high-side floating supply voltage: 1200v ? output voltage range: 10v to 24v ? min output current: 3a ? turn on/off time: 75ns(max) ? delay matching: 25ns(max) ? minimum input pulse width: 60ns(max) ? operating temperature range: -40c to 125c package w(typ) x d(typ) x h(max) ssop-b20w 6.50mm x 8.10mm x 2.01mm typical application circuits figure 1. typical application circuits gnd1 ena ina inb vreg nc gnd2 nc vcca outah pulse generator u vl o s r q + - u vl o 1pin 2v vccb outbh outbl mcb gnd1 outal mca nc gnd2 nc + - 2v regulator c vreg c vcc a pre- driver pre- driver up to 1200v to load c vccb vccb ena ina inb datashee t
datasheet d a t a s h e e t 2/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 contents general descr iption ........................................................................................................... ............................................................. 1 features ............................................................................................................................... ........................................................... 1 applicat ions .................................................................................................................. .................................................................. 1 key specific ations ............................................................................................................ ............................................................... 1 package w(typ) x d(typ) x h(max) ...................................................................................................... ................................... 1 typical applicat ion circu its .................................................................................................. ........................................................... 1 recommended range of external co nstants ....................................................................................... .......................................... 3 pin confi guration ............................................................................................................. ............................................................... 3 pin descrip tions .............................................................................................................. ................................................................ 3 description of pins and caut ions on layout of board ........................................................................... ............................................ 4 description of functions and exam ples of const ant setti ng ..................................................................... ........................................ 5 absolute maxi mum rati ngs ...................................................................................................... ...................................................... 7 recommended oper ating ra tings ................................................................................................. ................................................. 8 electrical characteristics ............................................................................................................................... .................................. 9 typical perform ance curv es .................................................................................................... ..................................................... 10 figure 8. vccb circui t current 1 (outb=l)...................................................................................... ....................................... 10 figure 9. vccb circuit current 2 (o utb=h) ..................................................................................... ....................................... 10 figure 10. vccb circuit current 3 (ina=10khz , duty=50%) ....................................................................... ............................. 10 figure 11. vccb circuit current 4 (ina=20khz , duty=5 0%) ....................................................................... ............................. 10 figure 12. vcca circuit current 1 (o uta=l) .................................................................................... ....................................... 11 figure 13. vcca circuit current 2 (o uta=h) .................................................................................... ...................................... 11 figure 14. logic(ina/inb)h/ l level input voltage .............................................................................. ........................................ 11 figure 15. outa output voltage vs ina input voltage (vccb=15v, v cca=15v, ta =25c) ............................................. ........ 11 figure 16. logic pull- down resistance ......................................................................................... ............................................. 12 figure 17. logic pu ll-down current ............................................................................................ ............................................... 12 figure 18. logic(ina)input mask time ............................................................................................................................... ........ 12 figure 19. ena i nput mask time ................................................................................................ .............................................. 12 figure 20. outa on resistance (source)......................................................................................... ....................................... 13 figure 21. outa on resistance (sink) .......................................................................................... .......................................... 13 figure 22. outb on resistance (source) ........................................................................................ ....................................... 13 figure 23. outb on resistance (sink) .......................................................................................... ......................................... 13 figure 24. turn on time (ina=pwm, inb=l) ...................................................................................... ................................... 14 figure 25. turn off time (ina=pwm, inb=l) ..................................................................................... .................................. 14 figure 26. turn on time (ina=l, in b=pwm) ...................................................................................... ................................... 14 figure 27. turn off ti me (ina=l, inb=pwm) ..................................................................................... .................................. 14 figure 28. mca on resist ance .................................................................................................. .............................................. 15 figure 29. mcb on resist ance .................................................................................................. .............................................. 15 figure 30. mca on threshold ................................................................................................... .............................................. 15 figure 31. mcb on thres hold ................................................................................................... .............................................. 15 figure 32. vccb uv lo on/off volt age ........................................................................................... ..................................... 16 figure 32. vccb uv lomask time ................................................................................................. ......................................... 16 figure 33. vcca uv lo on/off volt age ........................................................................................... ..................................... 16 figure 34. vcca uvlo ma sk time................................................................................................. ......................................... 16 power dissi pation ............................................................................................................. ............................................................ 17 thermal de sign ................................................................................................................ ............................................................ 17 i/o equivalent circu its ....................................................................................................... ........................................................... 18 physical dimension, tape and reel in formation ................................................................................. ......................................... 22
datasheet d a t a s h e e t 3/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 recommended range of external constants pin name symbol recommended value unit min. typ. max. vcca c vcca 0.1 1.0 - f vccb c vccb 0.1 1.0 - f vreg c vreg 0.1 3.3 10.0 f pin configuration pin descriptions pin no. pin name function 1 nc non -connection 2 gnd2 high -side ground pin 3 nc non -connection 4 mca high-side output pin for miller clamp 5 outal high-side output pin (sink) 6 outah high-side output pin (source) 7 vcca high-side power supply pin 8 nc non -connection 9 gnd2 high -side ground pin 10 nc non -connection 11 gnd1 low -side and input-side ground pin 12 ena input enabling signal input pin 13 ina logic input for low side gate driver output 14 inb logic input for low side gate driver output 15 vreg power supply pin for input circuit 16 vccb low -side and input-side power supply pin 17 outbh low-side output pin (source) 18 outbl low-side output pin (sink) 19 mcb low-side output pin for miller clamp 20 gnd1 low -side and input-side ground pin gnd1 n c 20 1 mcb g nd2 19 2 outbl 18 3 outbh m ca 17 4 vccb ou tal 16 5 vreg ou tah 15 6 inb v cc a 14 7 ina n c 8 ena g nd2 12 9 gnd1 n c 11 10 13 n c (top view)
datasheet d a t a s h e e t 4/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 description of pins and cautions on layout of board 1
datasheet d a t a s h e e t 5/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 description of functions and examples of constant setting 1) miller clamp function when ina=l and out pin voltage < v mcon (typ 2v), the internal mosfet of the mc pin is turned on.
datasheet d a t a s h e e t 6/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 2) under-voltage lockout (uvlo) function the BM60210FV-C incorporates the under-voltage lockout (uvlo) function both of vc ca and vccb. when the power supply voltage drops to the uvlo on volt age (typ 8.5v), the out pin will output t he ?l? signal. in addition, to prevent malfunctions due to noises, a mask time of t uvlomsk (typ 2.5s) is set on both the low and the high voltage sides. this ic does not have a function which feeds back the high voltage side state to the low voltage side. a fter the high voltage side uvlo is released, the input signal will take effect from the time after the input signal switches. 3
datasheet d a t a s h e e t 7/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 4) power supply startup / shutoff sequence inb outa vccb h l h l v uvloh v uvloh hi-z vcca l hi-z mca v uvloh v uvlol v uvlol v uvlol v uvlol v uvloh ina h l outb h l hi-z l hi-z mcb inb outa vccb h l h l v uvloh v uvloh hi-z vcca l hi-z mca v uvloh v uvlol v uvlol v uvlol v uvlol v uvloh ina h l outb h l hi-z l hi-z mcb : since the vcca to gnd2 pin voltage is lo w and the output mos does not turn on, the output pins become hi-z. : since the vccb to gnd1 pin voltage is low and the output mos does not turn on, the output pins become hi-z. figure 6. power supply startup / shutoff sequence
datasheet d a t a s h e e t 8/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 absolute maximum ratings (note 1) relative to gnd1. (note 2) should not exceed pd and tj=150c (note 3) derate by 9.5mw/c when operating above ta=25c. mounted on a glass epoxy of 70mm
datasheet d a t a s h e e t 9/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 electrical characteristics ? ? ? g g ?
datasheet d a t a s h e e t 10/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 typical performance curves 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 10 12 14 16 18 20 22 24 i cc11 [m a] vccb[v] 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 10 12 14 16 18 20 22 24 i cc12 [m a] vccb [v] ta = - 4 0 c ta = 2 5 c ta=125 c ta = - 4 0 c ta = 2 5 c ta=125 c figure 8. vccb circuit current 1 (outb=l) figure 9. vccb circuit current 2 (outb=h) 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 10 12 14 16 18 20 22 24 i cc13 [m a] vccb [v] 0.40 0.50 0.60 0.70 0.80 0.90 1.00 1.10 10 12 14 16 18 20 22 24 i cc14 [m a] vccb [v] ta=-40c ta=25c ta=125c ta=-40c ta=25c ta=125c figure 10. vccb circuit current 3
datasheet d a t a s h e e t 11/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 typical performance curves - continued 0 4 8 12 16 20 24 012345 out [v] ina [v] 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 10 12 14 16 18 20 22 24 i cc22 [m a] vcca [v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 10 12 14 16 18 20 22 24 v inh / v inl [v] vcca [v] 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 10 12 14 16 18 20 22 24 i cc21 [m a] vcca [v] figure 12. vcca circuit current 1 (outa=l
datasheet d a t a s h e e t 12/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 typical performance curves - continued 20 40 60 80 100 120 140 160 -50 -25 0 25 50 75 100 125 i ind [a] figure 16. logic pull-down resistance 20 30 40 50 60 70 80 90 100 -50 -25 0 25 50 75 100 125 r ind [k ?
datasheet d a t a s h e e t 13/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 typical performance curves - continued 0.2 0.4 0.6 0.8 1.0 1.2 1.4 -50 -25 0 25 50 75 100 125 r onl [ ? ? ? ?
datasheet d a t a s h e e t 14/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 typical performance curves - continued figure 24. turn on time (ina=pwm, inb=l) figure 25. turn off time (ina=pwm, inb=l) figure 26. turn on time (ina=l, inb=pwm) figure 27. turn off time (ina=l, inb=pwm) ta [c] ta [c] ta [c] ta [c] 35 40 45 50 55 60 65 70 75 -50 -25 0 25 50 75 100 125 t pona [ns] 35 40 45 50 55 60 65 70 75 -50 -25 0 25 50 75 100 125 t poffa [ns] vcca=10v vcca=15v vcca=24v vcca=10v vcca=15v vcca=24v 35 40 45 50 55 60 65 70 75 -50 -25 0 25 50 75 100 125 t ponb [ns] 35 40 45 50 55 60 65 70 75 -50 -25 0 25 50 75 100 125 t poffb [ns] vccb=10v vccb=15v vccb=24v vccb=10v vccb=15v vccb=24v
datasheet d a t a s h e e t 15/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 typical performance curves - continued figure 28. mca on resistance figure 29. mcb on resistance ta [c] ta [c] figure 30. mca on threshold figure 31. mcb on threshold ta [c] ta [c] 0.2 0.4 0.6 0.8 1.0 1.2 1.4 -50 -25 0 25 50 75 100 125 r onmc [ ? ?
datasheet d a t a s h e e t 16/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 typical performance curves - continued 8.0 8.5 9.0 9.5 10.0 -50 -25 0 25 50 75 100 125 v uvlobh/l [v] 8.0 8.5 9.0 9.5 10.0 -50 -25 0 25 50 75 100 125 v uvloah/l [v] figure 32. vccb uvlo on/off voltage figure 33. vccb uvlomask time ta [c] ta [c] v uvloah v uvloal 1.0 2.0 3.0 4.0 5.0 -50 -25 0 25 50 75 100 125 t uvlobmsk [s] figure 34. vcca uvlo on/off voltage figure 35. vcca uvlo mask time ta [c] ta [c] v uvlobh v uvlobl 1.0 2.0 3.0 4.0 5.0 -50 -25 0 25 50 75 100 125 t uvloamsk [s]
datasheet d a t a s h e e t 17/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 power dissipation thermal design please make sure that the ic?s chip temperature tj is not over 150c, while considering t he ic?s power consumption (w), package power (pd) and ambient temperature (ta). when tj=150 c is exceeded, the function as a semiconductor will not operate and some problems (ex. abnormal o peration of various parasitic elements an d increasing of leak current) occur. constant use under these circumstances leads to deterioration a nd eventually ic may destruct. tjmax=150c must be strictly followed under all circumstances. figure 36. ssop-b20w derating curve 0 25 50 75 100 125 150 0 0.5 1.0 1.5 1.19 w 0 25 50 75 100 125 150 0 0.5 1.0 1.5 a mbient temperature: ta[c] power dissipation:pd [w] measurement machine: th156
datasheet d a t a s h e e t 18/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 i/o equivalent circuits pin no name i/o equivalence circuits function 6 outah high-side output pin (source) 5 outal high-side output pin (sink) 17 outbh low-side output pin (source) 18 outbl low-side output pin (sink) 4 mca high-side output pin for miller clamp 19 mcb low-side output pin for miller clamp 13 ina logic input for high side gate driver output 14 inb logic input for low side gate driver output 12 ena input enabling signal input pin vccb gnd1 ina inb internal
datasheet d a t a s h e e t 19/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 4. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 5. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guarantee d under the conditions of each parameter. 6. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 7. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 8. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 9. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
datasheet d a t a s h e e t 20/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 operational notes ? continued 10. unused input terminals input terminals of an ic are often con nected to the gate of a mo s transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric fi eld from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 11. regarding input pins of the ic this ic contains p+ isolation and p substrate layers bet ween adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (a nd thus to the p substrate) should be avoided. figure 37. example of ic structure 12. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 13. area of safe operation (aso) operate the ic such that th e output voltage, output current, and power dissipation are all within the area of safe operation (aso).
datasheet d a t a s h e e t 21/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 ordering information b m 6 0 2 1 0 f v - ce 2 part number package fv: ssop-b20w rank c for automotive applications packaging and forming specificatione2: embossed tape and reel marking diagram ssop-b20w(top view) bm60210 part number marking lot number 1pin mark
datasheet d a t a s h e e t 22/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 physical dimension, tape and reel information package name ssop-b20w ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin
datasheet d a t a s h e e t 23/23 BM60210FV-C tsz02201-0818abh00140-1-2 ? 2016 rohm co., ltd. all rights reserved. 19. feb. 2016 rev.001 www.rohm.co.jp tsz22111 14 001 revision history date revision changes 19.feb.2016 001 new release
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number BM60210FV-C package ssop-b20w unit quantity 2000 minimum package quantity 2000 packing type taping constitution materials list inquiry rohs yes BM60210FV-C - web page

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